Etching 2020-05-12T02:22:54+00:00


The photo chemical etching process is used to produce very precise parts that would otherwise be difficult or
impossible to manufacture using conventional fabrication method.

Advantages of The Photo Chemical Etching

Low Cost and Design Flexibility

Compared to hard tooled parts, the photo chemical etching tooling is more efficient and far less expensive than typical hard tooling. In addition, design and drawing changes are expeditiously and inexpensively accomplished.

Short Delivery Time

The chemical photo etching can typically be produced in one or two days.

No Burrs and no stresses

In the photo chemical machining operation, the part configuration is achieved without any surface burrs and stresses.

Raw Materials to be worked
SUS 304, 301, 316, 631, 430 etc.
Al A5052, A1050 etc.
Ni Alloy 36Ni, 42Ni, 50Ni, 78Ni, Cobalt etc.
Cu Tough-Pitch Copper, C1020 etc.
Cu Alloy C5191, C5210, C7521, C7701, OLIN, EFTEC, TAMAC, DK, MF, KFC, BSP etc.
Fe Amorphous, Silicon steel board etc.
Special Steel Mo, BeCu(C1720) etc.
Working Limit

Thickness : 0.010mm~2.0mm
Size : Maximum 600mm x 600mm
* Materials to be worked have limitation of size and thickness

Process of Inspection

① Inspection before feeding of materials
Thickness, evenness and the surface state are inspected before materials are fed. In case of abnormality feeding of materials is immediately suspended and its report is made to the superior office.

② Midway inspection
Products on each line are inspected with the naked eye and stereoscope, and in case of etching the calibrations are inspected with pin gauge and stereoscope.

③ Sampling inspection
Products stored in the inspection room are subject to sampling inspection in accordance with JIS 9015 and only those pass the inspection qualify for the total number inspection.

④ The total number inspection
In principal the inspection is conducted with the naked eye and pin gauge, but inspection with measuring instruments (magnifier, stereoscope) is conducted on demand.


You can choose from the following part packaging options, regardless of the quantity.



Left in the sheet

Process Introduce

1. Materials
Quality, standard, evenness and looks of the materials received are checked and recorded.

Materials are immersed in alkaline solution to remove grease from the surface.

Dry film is coated on both sides of the material at 110℃.

Masks for each items are closely adhered to both sides of the material vacuously and the film is sensitized with UV lamp irradiation.

5. Development, Post-Baking
Exposed dry film is developed and baked.

The material is etched with ejection of FeCl₃ etching solution.

The material is immersed in 5% NaOH solution to remove dry film.

Sampling from each lot is conducted and test results are prepared after inspection with projector.

9. Packaging
Products are packed-in proper package for each lot and inspection is conducted before shipment (the test results are presented).

Processing limit

Etched Dimensional Tolerance
The dimensional tolerance depends on plate thickness. Generally it is 10%~15% of plate thickness

Work Limit
External and internal angles are rounded when etching

External angle(Ro) ≧ t × 40% t=Thickness
Internal angle(Ri) ≧ t × 80%

Thickness(T) Minimum D Size Actual Minimum D Size Actual Minimum W Size D, W Tolerance
Subject to Testing Subject to Testing ≒ 0.5 Subject to Testing
50㎛ Abt.±0.25t
125㎛ ≒ 0.7t ≒ 0.8t
175㎛ Abt.|±0.16t

“D”: 0.8 X T
Special tolerances such as ± 0.01 μm other than general tolerance differ according to the characteristics of the product.

Line Size Lead Time(min) Productive Capacity(Sheet)
8hours 24hours
Cleaning SUS 0.1t x 400 x 500 8 1,500 3,700
Laminating 1(x 2) 2,600 6,500
Exposure 1.5(x 3) 2,400 7,200
Baking 8.5 1,500 3,800
Etching 7.5 1,800 3,600
Stripping 10(x 2) 3,000 7,500
Applied Parts

Parts for Machinery
Mesh Filter
Grid Charge

Parts for Jig
Mask for Spark
Printer Head
Blade for Hair Clipper
Blade for Razor

Parts for External
Meter Board
Key Pad for Cell Phone
Gasket for Cell Phone

Parts for Semiconductor
Semi-Conductor L/F
Sensor Coil for Electromagnetic Level
Vent for Battery
Encorder Disk
Inspection EML